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Thick film hybrid technology.

Author(s)
M. Aslam Dr. Abdul Qadeer Khan Research Laboratories, Kahuta, Pakistan
T. A. Ali Dr. Abdul Qadeer Khan Research Laboratories, Kahuta, Pakistan
M. R. Bhatti Dr. Abdul Qadeer Khan Research Laboratories, Kahuta, Pakistan
K. Mahmood Dr. Abdul Qadeer Khan Research Laboratories, Kahuta, Pakistan
A. L. Sajid Dr. Abdul Qadeer Khan Research Laboratories, Kahuta, Pakistan
I. A. Fakhri Dr. Abdul Qadeer Khan Research Laboratories, Kahuta, Pakistan
S. S. Hussain Dr. Abdul Qadeer Khan Research Laboratories, Kahuta, Pakistan
J. A. Mirza Dr. Abdul Qadeer Khan Research Laboratories, Kahuta, Pakistan
Abstract
The packaging of many projects requires large number of electronic components, with the constraint of fitting them in a relatively small space. The concept of miniaturization is not new, probably it started soon after the development of transistor. Hybrid technology provides useful means for assembling all major categories of electronic components in small area. The thick film technology for manufacturing of hybrid circuits is presented in this paper.
Publication Details
Page(s) 35-39
DOI DOI not available
Published Journal: Proceedings of Pakistan Academy of Sciences, Volume: 32, Issue: 1--4, Year: 1995

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