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Wafer pre-aligner system based on vision information processing.

Author(s)
Ming Cong School of Mechanical Engineering, Dalian University of Technology, Dalian, China
Xiangji Kong School of Mechanical Engineering, Dalian University of Technology, Dalian, China
Du Yu School of Mechanical Engineering, Dalian University of Technology, Dalian, China
Jing Liu School of Mechanical Engineering, Dalian University of Technology, Dalian, China
Abstract
Wafer pre-alignment is one of the most difficult and important part in wafer transmitting system. The key point of alignment is the position identification and information process. It is explored in this paper to use a new algorithm of vision information processing to obtain the special area of wafer edge and then concentrate to some feature points of wafer by which the wafer can be located. The basis principle of algorithm is to integrate least squares regression fitting, weighted means and compromise of wavelet coefficient method together in vision part. Also a new mechanical structure and vision system has been established to process the data and locate wafer. Experimental test is given showing that the system can carry out the alignment of wafer well and accurately by using the proposed algorithm and structure.
Publication Details
Page(s) 1245-1251
DOI DOI not available
Published Journal: Information technology Journal, Volume: 6, Issue: 8, Year: 2007

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