A bibliometric analysis on condition monitoring of machinery using ir thermography | [ARPN Journal of Engineering and Applied Sciences • 2023]

Author(s):

1. Ch. Vinay Kumar Reddy: Department of Mechanical Engineering, Koneru Lakshmaiah Educational Foundation, Vaddeshwaram, Guntur District, Andhra Pradesh, India; Department of Mechanical Engineering, SR University, India

2. G. Diwakar: Department of Mechanical Engineering, Koneru Lakshmaiah Educational Foundation, Vaddeshwaram, Guntur District, Andhra Pradesh, India

Abstract:

In order to extend the life of machinery, condition monitoring of equipment has become crucial in every industry or power plant. IR Thermography is a strong tool for condition monitoring since it can detect flaws earlier than other techniques. The most important technique for condition monitoring is infrared thermography. Machine condition monitoring has evolved along with machine maintenance, from manual maintenance through approaches involving the use of sensors to the now under discussion methods and techniques centered on shared automation, data processing, and exchange. The purpose of this paper is to give a brief summary of the academic work that has been done on using IR thermography to monitor the status of machinery. In order to present an up-to-date, content-based analysis that includes bibliometric performance analysis and systematic literature evaluation, this paper evaluates the body of current literature. The writers may concentrate on identifying the most important researchers, journals, and publications, as well as the most significant and influential researchers, thanks to the mix of literature review methodologies used. These conclusions have prompted the authors to outline research trends pertinent to the studied domain and, in addition, to identify potential futur e research goals from engineering viewpoints.

Page(s): 2286-2295

DOI: DOI not available

Published: Journal: ARPN Journal of Engineering and Applied Sciences, Volume: 18, Issue: 20, Year: 2023

Keywords:

Bibliometric analysis , Scientometric analysis , Infrared thermography , fault diagnosis , condition monitoring

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