Thick film hybrid technology. | [Proceedings of Pakistan Academy of Sciences • 1995]

Author(s):

1. M. Aslam: Dr. Abdul Qadeer Khan Research Laboratories, Kahuta, Pakistan

2. T. A. Ali: Dr. Abdul Qadeer Khan Research Laboratories, Kahuta, Pakistan

3. M. R. Bhatti: Dr. Abdul Qadeer Khan Research Laboratories, Kahuta, Pakistan

4. K. Mahmood: Dr. Abdul Qadeer Khan Research Laboratories, Kahuta, Pakistan

5. A. L. Sajid: Dr. Abdul Qadeer Khan Research Laboratories, Kahuta, Pakistan

6. I. A. Fakhri: Dr. Abdul Qadeer Khan Research Laboratories, Kahuta, Pakistan

7. S. S. Hussain: Dr. Abdul Qadeer Khan Research Laboratories, Kahuta, Pakistan

8. J. A. Mirza: Dr. Abdul Qadeer Khan Research Laboratories, Kahuta, Pakistan

Abstract:

The packaging of many projects requires large number of electronic components, with the constraint of fitting them in a relatively small space. The concept of miniaturization is not new, probably it started soon after the development of transistor. Hybrid technology provides useful means for assembling all major categories of electronic components in small area. The thick film technology for manufacturing of hybrid circuits is presented in this paper.

Page(s): 35-39

DOI: DOI not available

Published: Journal: Proceedings of Pakistan Academy of Sciences, Volume: 32, Issue: 1--4, Year: 1995

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